Cutting-edge technology that realizes miniaturization and high performance of semiconductors!
Bear chip mounting, flip chip mounting, wire bonding, and stud bumping. We support all types of board mounting!
We implement semiconductor bare chips on various circuit boards using a variety of methods. It is possible to mount semiconductor bare chips and peripheral passive components on glass epoxy boards, ceramic boards, three-dimensional wiring boards (MID), flexible boards, glass boards, and silicon boards. Furthermore, we flexibly handle the development, prototyping, and small to medium-scale production of small modules and semiconductor packages, including BGA packages, power modules, and image sensor packages. We also perform specific tasks such as wire bonding only and special mounting, accepting orders starting from just one piece.
- Company：マイクロモジュールテクノロジー
- Price：Other
